This is a simple example of vector addition to describe how to use HLS kernels with HBM (High Bandwidth Memory) for achieving high throughput.
KEY CONCEPTS: High Bandwidth Memory, Multiple HBM pseudo-channels
This is Simple example to demonstrate how to use HBM Platform. Two cases are executed, Single HBM Pseudo-Channel(PC) is used for two inputs and one output; three separate PCs are used for each argument of kernels. Individual PC for each buffer will provide more bandwidth for the application.
cl_mem_ext_ptr object needs to be used in cases where memory
assignment is done by user.
cl_mem_ext_ptr_t bufExt; bufExt.obj = source_in1.data(); bufExt.param = 0; bufExt.flags = n | XCL_MEM_TOPOLOGY; // specify n the PC number which needs to be targeted (0:31) cl::Buffer buffer_input1(context, CL_MEM_READ_ONLY | CL_MEM_EXT_PTR_XILINX | CL_MEM_USE_HOST_PTR, sizeof(uint32_t) * size, &bufExt, &err));
compute unit interfaces are associated to fixed HBM PCs using
[connectivity] sp=krnl_vadd_1.in1:HBM[0:3] sp=krnl_vadd_1.in2:HBM[0:3] sp=krnl_vadd_1.out_r:HBM[0:3]
It specify that kernel interfaces (in1,in2 and out_r) should be connected such a way that it should have access to HBM PCs 0 to 3. System linker will make sure this requirement while building the design.
For Case1, all three buffers (in1,in2, and out_r) will be created inside Single bank and application will run and performance will be reported. For Case2, All three buffers will be created into different banks and application will run and performance will be reported. For Case2, three different banks will give higher DDR bandwidth compare to case1, so performance of Case2 will be better compare to case1. Following is the real log reported while running on U280 platform:
Platform Name: Xilinx INFO: Reading ./build_dir.hw.xilinx_u50_gen3x16_xdma_201920_3/krnl_vadd.xclbin Loading: './build_dir.hw.xilinx_u50_gen3x16_xdma_201920_3/krnl_vadd.xclbin' Trying to program device: xilinx_u50_gen3x16_xdma_201920_3 Device: program successful! Running CASE 1 : Single HBM PC for all three Buffers Each buffer is connected to same HBM PC. input 1 -> PC 0 input 2 -> PC 0 output -> PC 0 [CASE 1] THROUGHPUT = 8.0181 GB/s Running CASE 2: Three Separate PCs for Three Buffers Each buffer is allocated with different HBM PC. input 1 -> PC 1 input 2 -> PC 2 output -> PC 3 [CASE 2] THROUGHPUT = 24.4078 GB/s TEST PASSED
Platforms containing following strings in their names are not supported for this example :
_u25_ u30 u200 zc vck u250 aws-vu9p-f1 samsung _u2_ nodma
Application code is located in the src directory. Accelerator binary files will be compiled to the xclbin directory. The xclbin directory is required by the Makefile and its contents will be filled during compilation. A listing of all the files in this example is shown below
Access these files in the github repo by clicking here.
COMMAND LINE ARGUMENTS¶
Once the environment has been configured, the application can be executed by
./hbm_simple <krnl_vadd XCLBIN>